Product Description
Optimal placement rate: 6.500 cph
Nominal placement rate: 5.000 cph
Applicable Components: 0402 – 30 mm (PLCC 84, (1.18″)) Cyberoptics laser alignment Head # 1
0402 – 6 mm (SO 8, (0.24″)) Cyberoptics laser alignment Head # 2
QFP 32 mm (1.26″) with pin pitch down to 0.3 mm
(12 mil)
Standard area CCD camera 32 mm
with the use of back lighting
QFP 45 mm (1.77″) with pin pitch down to 0.5 mm (20
mil)
Optional area CCD camera 45 mm
with the use of back lighting
QFP 54 mm (2.1″) with pin pitch down to 0.5 mm
(20 mil)
Optional area CCD camera 54 mm
with the use of back lighting; Under
special conditons
Darkground BGA, μBGA, CSP, with regular pitches;
1.5 mm-15 mm : Min. ball pitch down to 0.5 mm (20
mil), Min. ball diameter down to 0.2 mm (8 mil)
10 mm-32 mm : Min. ball pitch down to 0.8 mm (31
mil), Min. ball diameter down to 0.4 mm (16 mil)
10 mm-45 mm : Min. ball pitch down to 1.27 mm (50
mil), Min. ball diameter down to 0.6 mm (23 mil)
10 mm-54 mm : Min. ball pitch down to 1.27 mm (50
mil), Min. ball diameter down to 0.6 mm (23 mil)
Optional area CCD camera 15 mm
with the use of the optional side illumination
unit
Standard area CCD camera 32 mm
with the use of the optional side or
front illumination unit
Optional area CCD camera 45 mm
with the use of the optional side illumination
unit or front illumination
unit
Optional area CCD camera 54 mm
with the use of the optional front illumination
unit
Irregularly shaped SMDs like connectors, transformers,
coils etc.
Max. components height: 15 mm 17 mm possible under special
conditions
Mounting accuracy:
(x,y) 3 s
0.08 mm for chips and SOIC
0.04 mm for QFPs
Laser alignment system
With the standard area CCD camera
and fine mode placement